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TB 26-10 Printed Circuit Board Assembly Chip Resistor Body Cracking

Published November 3, 2026 10:35 am • Updated November 3, 2026 10:35 am •
TB 26-10 Printed Circuit Board Assembly Chip Resistor Body Cracking
Photo via NASA

For more information, contact Joel W. Sills, Langley Research Center, joel.w.sills@nasa.gov. Download PDF here Chip resistors are widely used in NASA projects, yet cases of alumina substrate cracking during environmental testing are rare. Two instances of thick-film chip resistor cracking were observed during thermal cycling after vibration, with fractures occurring across the short axis due […]

For more information, contact Joel W. Sills, Langley Research Center, joel.w.sills@nasa.gov. Download PDF here Chip resistors are widely used in NASA projects, yet cases of alumina substrate cracking during environmental testing are rare. Two instances of thick-film chip resistor cracking were observed during thermal cycling after vibration, with fractures occurring across the short axis due […]

Source: NASA — Original report ↗

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Original source: NASA ↗